Join Ben Lee from Intel to learn about the many new changes inhardware design that are taking place in desktop, laptop and servercomputing. This will be an interactive session with questionsencouraged from the audience. We will be talking about new platforminnovations such as the new Intel Core 2 Duo processor, Conroe, as wellas future chips and the new mobile Core 2 Duo chip. He will also talkabout improvements in battery life, virtualization technology andsecurity improvements. Ben will cover processor, chipset and associatedtechnologies. He will cover trends in the industry like legacy removaland new technologies such as, Intel VIIV and vPro.
Ben H. Lee III is an Intel Field Sales Engineer located in Beaverton,Oregon. He covers the Northern Midwest Territory of the US andresponsible for $25M in annual revenue. He started working at Intel in1996, and held various positions in engineering for desktop andnetworking products. He went on to marketing in 2000, and started inSales in 2004. Ben holds one patent in adaptive synchronization of dataacross networks.
Presented by
Ben H. Lee III, Intel Field Sales Engineer